DDR5 BGA Reballing Stencil – BGA78 82 96 102 132 152 Template
DDR5 BGA Reballing Stencil – Multi-Size Stainless Steel Template
Take the guesswork out of BGA chip rework with this precision-engineered stainless steel reballing stencil. Designed for DDR5 memory and drive chips, this template supports six BGA configurations — BGA78, BGA82, BGA96, BGA102, BGA132, and BGA152 — making it a versatile essential for electronics technicians, repair shops, and semiconductor professionals.
Why Choose This Reballing Stencil?
- Multiple Size Options: Covers BGA78, BGA82, BGA96, BGA102, BGA132, and BGA152 specifications to accommodate a wide range of chip sizes and types, giving you flexibility across diverse repair and production tasks.
- Precise Hole Design: Laser-cut holes ensure accurate solder ball alignment, significantly improving placement consistency and first-pass success rates.
- Wide Application Range: Ideal for electronics repair, semiconductor packaging, and large-scale soldering — a must-have tool for professionals in BGA rework.
- Enhanced Soldering Efficiency: Minimizes solder ball waste and reduces soldering defects, helping boost overall production efficiency while lowering operational costs.
- Easy to Maintain: Simply clean the stencil regularly with a cleaning solution to prevent residue buildup and ensure consistently accurate results over time.
Specifications
- Type: Reballing Stencil / Template
- Material: Stainless Steel
- Color: Silver
- Size: 90 × 90 mm (3.54 × 3.54 in)
- Compatible BGA Types: BGA78, BGA82, BGA96, BGA102, BGA132, BGA152
- Assembly Required: No
- Made in Mainland China
Package Includes
- 1 PC or 1 Set Reballing Template (optional — select your size at checkout)
Note: Please allow ±1–2 cm variance due to manual measurement. Slight color differences may occur due to display resolution variations.
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Frequently Asked Questions
Q: What BGA sizes does this reballing stencil support?
A: This reballing stencil supports six BGA configurations: BGA78, BGA82, BGA96, BGA102, BGA132, and BGA152. You can purchase individual sizes or a full set depending on your needs.
Q: What material is this BGA reballing template made from?
A: The stencil is made from durable stainless steel, which ensures long-lasting performance, precise hole geometry, and easy cleaning after use.
Q: Is this stencil suitable for DDR5 memory chip rework?
A: Yes, this template is specifically designed for DDR5 memory and drive U chips, making it well-suited for professional BGA reballing, semiconductor packaging, and electronics board-level repair tasks.
Q: How do I clean and maintain the reballing stencil?
A: After each use, clean the stencil with a dedicated electronics cleaning solution or isopropyl alcohol to remove any solder residue. Regular cleaning helps maintain hole precision and extends the usable life of the template.
Production & Packaging Notice
To maintain high stock availability and fast shipping times, our items are sourced from multiple verified manufacturing facilities. While the core quality, materials, and product specifications remain identical, you may notice slight variations in the packaging design, manufacturing origin, or the wording of the printed instructions.